To develop the tire pressure sensors, we have designed and developed for absolute pressure sensors, it's depending on micro-machining technology of micro-MEMS Silicon Piezoresistive absolute pressure sensor, sensor which integrated Whiston bridge.
Force-resistance film distribution inside the square designed by the book's four-sided edge of center point, arranged by 110 Crystallographic, a longitudinal layout, a couple of tangential layout, thus forming the Whiston strain bridge. Resistance wide 8um, full-length 60um typical powerful strain can assure 20mV/V output sensitivity. Ion implantation doping of resistance formed, with excellent uniformity and accuracy of doping to make sure the stability from the zero point and sensitivity, impedance five k?? resistance design using silicon-Silicon bonding technology to kind an absolute high temperature pressure sensor for vacuum reference Chamber.
Silicon-Pyrex for it than the Anodic bonding of glass to form an absolute pressure reference cavity swells have outstanding thermal matching, so it can be much more effective for the thermal and temporal stability with the solution. Employing this design technology unit of a different important benefit is that it might greatly lessen chip size, this style with the cell chip size 1mmx1mm, 1 four silicon wafers is usually created over more than 7,000 British force-sensitive element, and working with silicon-the glass bond developed cell chip size from 1.5x1.5mm to 2.2x2.2mm, as well as a four-inch silicon wafers could be made pressure-sensitive element and three,400 respectively 1600, it was clear that our design aids to lessen unit production fees. Needless to say, working with this design on the premise that mastering Silicon-Silicon bonding technology and thin silicon diaphragm technology. In view with the higher variety of tire heavy duty industrial pressure sensor, thick Silicon diaphragm, working with precision mechanical thinning or isotropic etching tactics are certainly not difficult to meet the style requirements, even when the style variety extends variety of AAP and MAP absolute stress sensor for automobile, making use of Wise Reduce technology or wafer electrochemical selective etching of silicon thin-film technologies will not be difficult to get 15~20um thick.
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